workshop sc device..day 2

pergi workshop sc device lagi hari ni, makin clear rasanya steps yg perlu diikut untuk buat a simple basic device such as pn junction (transistor)...every steps consists of oxidation process in its special, exclusive furnace then go to photoresist and lithography process in the yellow room, followed by the cleaning process in the next room which have the rinse and spin dry machine , then OBE the Oxide Buffer Etch process, to etch the oxide layer i think, clean it, shake it in the 1:10 dilution of a special chemical(forgot the name,..nanti tanya Farah at evening session)..until the liquid is not attach to the surface of the wafer that we put it backwards while doing the etching process..okay then..break for lunch and solat..then continue this evening..the most hard part for today is when doing the alignment of the already-patterned wafer from mask 1, to litho it with mask three for the connection gate (i think..) we have to make sure the alignment is accurate as possible by looking at the marks that we have at the patterned-wafer and the mask...so thats all..enough for the sc fabrication at the moment....